Cov txheej txheem ntws ntawm tooj liab bar mos

Cov txheej txheem nquag rau cov roj teeb nres txuas tooj liab tuav yog molecular diffulation vuam. Cov hauv qab no yog cov kev ua tshwj xeeb:

1. Tau xaiv cov khoom xaiv: xaiv T2 tooj liab ntawv nyiaj nrog cov kev qhia tshwj xeeb.

2. Mog Ua: Ua cov pwm raws li cov neeg siv khoom xav tau.

3.Cov khoom: txiav cov ntawv xov tooj liab rau hauv qhov loj me raws li qhov yuav tsum tau ua.

4.Caj muag thiab cuab yeej: ntxuav cov nplaim tooj liab ntawv ci thiab muab nws. Ua ntej vuam, ib qho kev siv tshuaj yuav siv los tswj qhov ntev thiab dav kev sib txawv ntawm ntau txheej ntawm tooj liab ntawv ntawv.

5.Acid Ntxuav: hle cov impurities thiab oxide txheej los ntawm cov npoo tooj liab ntawv ci.

6.Suraceface kev kho mob: lub saum npoo ntawm tooj liab cov tuav tuaj yeem kho nrog Tin plating, nyiaj plating, lossis npib tsib xee raws li cov cai.

7.thermal rwb thaiv tsev vuam: molecular diffusion vuam yog siv, uas yog tsim los ntawm cua sov thiab nias nrog siab tam sim no. Cov txheej txheem cua sov ntawm cov cuab yeej siv thaum lub sijhawm vuam yog lub rwb thaiv tsev cov txheej txheem, nrog ib qho kub thiab tsawg dua ntawm lub tooj liab bar mos txuas.

8.Txoj thiab Deburring: Ib qho me me ntawm burrs tsim thaum nruab nrab ntawm kev ua cov cim stamped.

9.Drilling: tho qhov nyob rau hauv overlapping nto thiab lwm thaj chaw raws li cov neeg yuav tsum tau ua.

10.Xev polishing: Ua rau saum npoo ntawm tooj liab bar du thiab huv si.

11.Taib plating ntawm Conductive Conductive: Cov chaw tiv tauj rau hauv cheeb tsam thiab txhim kho kev ua haujlwm.

12.Saib zoo li daim ntawv: Qhov kev sib txuas tau pom kev sib txuas tuaj yeem them nrog cov tes tsho rwb thaiv tsev raws li ib nrab lossis ib nrab. Kev ua tiav yog ua tiav siv fixtures thiab jigs, feem ntau tsuas yog khoov kho kho. Yog tias muaj loj tooj liab bar mos mos, yog cov khoom siv yog yuav tsum tau coj lawv.

13.Packaging thiab cia: Ntim khoom tiav thiab khaws cia rau hauv lub tsev rau khoom.